The U.S. National Science Foundation has awarded Clark Atlanta University with a $2 million grant for an initiative aimed at strengthening semiconductor research and education across Historically Black Colleges and Universities. As principal investigator and lead institution for this two-year project, CAU will lead the HBCU CHIPS Network. HBCU CHIPS Network is a collaborative partnership that unites HBCUs, government agencies, academia, and industry.
With the funding, CAU will establish the administrative infrastructure and protocols necessary to integrate member institutions into national semiconductor research and workforce development activities. A key component of this initiative will involve the creation of shared facility protocols that leverage the strengths and capabilities of participating universities.
“The HBCU CHIPS Network will allow researchers to advance the microelectronics field by leveraging collective research expertise, facilities, and educational resources at HBCUs,” said Dr. Frances Williams, Vice President for Research and Sponsored Programs at CAU and principal investigator on the project. “The CHIPS Network will support investigators in providing innovative solutions to the design and manufacturing of microchips in collaboration with industry partners.”
The vision is to foster a dynamic environment for students through meetings and seminars. Another aspect, an electronic database designed to connect them with internship and experiential learning opportunities within the semiconductor field.
The initiative also calls for a multi-institutional research effort dedicated to the design and fabrication of an integrated microelectronic system. This includes addressing challenges related to packaging and reliability.
Power of Partnership
There are six partnering institutions playing a crucial role in this network. Alabama A&M University will focus on developing thermoelectric materials and integrated power/cooling devices. Delaware State University will work on optimizing 2D-3D material integration. Georgia Institute of Technology will focus on improving chip-to-system packaging. Meanwhile, Jackson State University and North Carolina A&T State University will develop 2D semiconductor devices and optoelectronics. Norfolk State University will explore semiconductor packaging using polymer and boron nitride composites. Additionally, North Carolina A&T will also research heterogeneous packaging integration.